姓名:姚海龙 职称:助理研究员 电话:62795403 邮箱:hailongyao@tsinghua.edu.cn 主页:http://learn.tsinghua.edu.cn:8080/2009990119/hailongyao.html 教育背景工学学士 (计算机科学与技术), 天津大学, 中国, 2002; 工学博士 (计算机科学与技术), 清华大学, 中国, 2007. 研究领域集成电路物理设计, 可制造性设计 研究概况2007年博士毕业后,我前往加州大学圣迭戈分校(UCSD),与计算机科学工程系Andrew B. Kahng教授合作,从事博士后研究工作。博士后工作期间,我的主要研究方向包括可制造性设计方法、时延和漏电流功耗优化等。在此期间,我发表DAC 2008论文一篇、ICCAD 2008论文一篇(荣获最佳论文提名),申请UCSD专利一项,另有两篇期刊论文被IEEE Trans. on CAD of Integrated Circuits and Systems录用。目前,我所在的研究组主要从事VLSI物理设计方面的研究,包括布图规划、布局、布线、时钟树综合与布线、时序分析与优化等。 研究课题 国家核高基重大专项: 先进EDA平台开发 (2008-2010). 奖励与荣誉ICCAD 2006、2008: 最佳论文候选 (2006, 2008); 中国计算机学会优秀博士论文提名 (2007); 清华大学优秀博士论文二等奖 (2007). 学术成果[1] A. B. Kahng, C.-H. Park, X. Xu, and H. Yao (correspondent author). Layout Decomposition Approaches for Double Patterning Lithography. IEEE Trans. on CAD of Integrated Circuits and Systems, Accepted. [2] K. Jeong, A. B. Kahng, C.-H. Park, and H. Yao (correspondent author). Dose Map and Placement Co-Optimization for Improved Timing Yield and Leakage Power. IEEE Trans. on CAD of Integrated Circuits and Systems, Accepted. [3] H. Yao, S. Sinha, J. Xu, C. Chiang, Y. Cai, and X. Hong. Efficient range pattern matching algorithm for process-hotspot detection. IET Circuits, Devices & Systems, vol. 2, no. 1, pp. 2-15, 2008. [4] H. Yao, Y. Cai, Q. Zhou, and X. Hong. Multilevel routing with redundant via insertion. IEEE Trans. on Circuits and Systems II: Express Briefs, vol. 53, no. 10, pp. 1148-1152, 2006. [5] A. B. Kahng, C.-H. Park, X. Xu, and H. Yao (speaker). Layout Decomposition for Double Patterning Lithography. Proc. IEEE/ACM International Conference on Computer-Aided Design (ICCAD 2008), 2008, pp. 465-472. (Best Paper nomination) [6] K. Jeong, A. B. Kahng, C.-H. Park, and H. Yao (speaker). Dose Map and Placement Co-optimization for Timing Yield Enhancement and Leakage Power Reduction. Proc. IEEE/ACM Design Automation Conference (DAC 2008), 2008, pp. 516-521. [7] H. Yao, S. Sinha, C. Chiang, X. Hong, and Y. Cai. Efficient Process-hotspot Detection Using Range Pattern Matching. Proc. IEEE/ACM International Conference on Computer-Aided Design (ICCAD 2006), 2006, pp. 625-632. (Best Paper nomination) |